INTERNATIONAL PATENT: SUZHOU KEYANG SEMICONDUCTOR TECHNOLOGY CO., LTD., 苏州科阳半导体有限公司 FILES APPLICATION FOR "LED CHIP FAN-OUT WAFER LEVEL PACKAGING STRUCTURE AND PACKAGING METHOD"

GENEVA, June 9 -- SUZHOU KEYANG SEMICONDUCTOR TECHNOLOGY CO., LTD. (No. 568, Fangqiao Road, Caohu Street, Xiangcheng DistrictSuzhou, Jiangsu 215143), 苏州科阳半导体有限公司 (中国江苏省苏州市相城区漕湖街道方桥路568号) filed a patent application (PCT/CN2024/104454) for "LED CHIP FAN-OUT WAFER LEVEL PACKAGING STRUCTURE AND PACKAGING METHOD" on Jul 09, 2024. With publication no. WO/2025/112543, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) ...