INTERNATIONAL PATENT: SUMCO CORPORATION, 株式会社ＳＵＭＣＯ FILES APPLICATION FOR "NOTCH FORMATION POSITION DETERMINATION METHOD, NOTCH FORMATION METHOD, WAFER MANUFACTURING METHOD, NOTCH FORMATION POSITION DETERMINATION DEVICE, NOTCH FORMATION DEVICE AND WAFER MANUFACTURING SYSTEM"

GENEVA, Aug. 25 -- SUMCO CORPORATION (1-2-1, Shibaura, Minato-ku, Tokyo1058634), 株式会社ＳＵＭＣＯ (東京都港区芝浦一丁目２番１号) filed a patent application (PCT/JP2024/039363) for "NOTCH FORMATION POSITION DETERMINATION METHOD, NOTCH FORMATION METHOD, WAFER MANUFACTURING METHOD, NOTCH FORMATION POSITION DETERMINATION DEVICE, NOTCH FORMATION DEVICE, AND WAFER MANUFACTURING SYSTEM" on Nov 06, 2024. With publication no. WO/2025/173322, the details related to the patent application was published on Aug 21, 2025.

Notably, the patent application was submitted under the International Patent Classification (IP...