GENEVA, July 3 -- STEMCO CO., LTD. (79-44, Gwahaksaneop 4-ro, Oksan-myeon, HeungdeokguCheongju-SiChungcheongbuk-do 28122), 스템코 주식회사 (충청북도청주시흥덕구 옥산면 과학산업4로 79-44) filed a patent application (PCT/KR2024/015960) for "MULTI-LAYER SUBSTRATE, ELECTRONIC DEVICE INCLUDING SAME, AND METHOD FOR MANUFACTURING MULTI-LAYER SUBSTRATE" on Oct 21, 2024. With publication no. WO/2025/135438, the details related to the patent application was published on Jun 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is manag...