INTERNATIONAL PATENT: STEMCO CO., LTD., 스템코 주식회사 FILES APPLICATION FOR "FLEXIBLE CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR AND SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE WHICH COMPRISE FLEXIBLE CIRCUIT BOARD"

GENEVA, Jan. 6 -- STEMCO CO., LTD. (79-44, Gwahaksaneop 4-ro, Oksan-myeon, HeungdeokguCheongju-SiChungcheongbuk-do 28122), 스템코 주식회사 (충청북도청주시흥덕구 옥산면 과학산업4로 79-44) filed a patent application (PCT/KR2025/007492) for "FLEXIBLE CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE WHICH COMPRISE FLEXIBLE CIRCUIT BOARD" on May 30, 2025. With publication no. WO/2026/005315, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classifica...