INTERNATIONAL PATENT: STEMCO CO., LTD., 스템코 주식회사 FILES APPLICATION FOR "FLEXIBLE CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR AND SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING FLEXIBLE CIRCUIT BOARD"

GENEVA, May 6 -- STEMCO CO., LTD. (79-44, Gwahaksaneop 4-ro, Oksan-myeon, HeungdeokguCheongju-SiChungcheongbuk-do 28122), 스템코 주식회사 (충청북도청주시흥덕구 옥산면 과학산업4로 79-44) filed a patent application (PCT/KR2024/015956) for "FLEXIBLE CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING FLEXIBLE CIRCUIT BOARD" on Oct 21, 2024. With publication no. WO/2025/089724, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (...