INTERNATIONAL PATENT: SPREADTRUM COMMUNICATIONS (SHANGHAI) CO., LTD., 展讯通信（上海）有限公司 FILES APPLICATION FOR "PACKAGING STRUCTURE, CHIP STRUCTURE AND MANUFACTURING METHOD FOR PACKAGING STRUCTURE"

Posted On: 2025-09-08

GENEVA, Sept. 8 -- SPREADTRUM COMMUNICATIONS (SHANGHAI) CO., LTD. (Spreadtrum Center, Building No. 1, Lane 2288, Zuchongzhi Road, China (Shanghai) Pilot Free Trade Zone,Pudong New Area, Shanghai 201203), 展讯通信（上海）有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区祖冲之路2288弄展讯中心1号楼) filed a patent application (PCT/CN2025/077631) for "PACKAGING STRUCTURE, CHIP STRUCTURE, AND MANUFACTURING METHOD FOR PACKAGING STRUCTURE" on Feb 17, 2025. With publication no. ...

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INTERNATIONAL PATENT: SPREADTRUM COMMUNICATIONS (SHANGHAI) CO., LTD., 展讯通信（上海）有限公司 FILES APPLICATION FOR "PACKAGING STRUCTURE, CHIP STRUCTURE AND MANUFACTURING METHOD FOR PACKAGING STRUCTURE"