INTERNATIONAL PATENT: SOUTH CHINA UNIVERSITY OF TECHNOLOGY, 华南理工大学 FILES APPLICATION FOR "THREE-DIMENSIONAL HETEROGENEOUS INTEGRATED MILLIMETER WAVE SYSTEM PACKAGE STRUCTURE"

GENEVA, Feb. 2 -- SOUTH CHINA UNIVERSITY OF TECHNOLOGY (381 Wushan Road, Tianhe District,Guangzhou, Guangdong 510641), 华南理工大学 (中国广东省广州市天河区五山路381号) filed a patent application (PCT/CN2023/111666) for "THREE-DIMENSIONAL HETEROGENEOUS INTEGRATED MILLIMETER WAVE SYSTEM PACKAGE STRUCTURE" on Aug 08, 2023. With publication no. WO/2025/020228, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Invento...