INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, SONY DEPTHSENSING SOLUTIONS SA/NV FILES APPLICATION FOR "A SENSING MODULE FOR COMBINED IMAGING AND DEPTH SENSING, AN OPTICAL SYSTEM, A METHOD AND COMPUTER PROGRAM"

GENEVA, Oct. 4 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-choAtsugi-shi, Kanagawa 243-0014), SONY DEPTHSENSING SOLUTIONS SA/NV (Rue Jules Cockx 81160 Auderghem) filed a patent application (PCT/EP2025/056618) for "A SENSING MODULE FOR COMBINED IMAGING AND DEPTH SENSING, AN OPTICAL SYSTEM, A METHOD AND COMPUTER PROGRAM" on Mar 11, 2025. With publication no. WO/2025/201872, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FERRACINI ALVES, Renato (c/o SONY DEPTHSENSING SOLUTIONS SA/NVRue Jules Cockx 81160 Auderg...