INTERNATIONAL PATENT: SONOSILICON CO., LTD., 杭州荷声科技有限公司 FILES APPLICATION FOR "NEW MULTI-CHIP ON-CHIP ULTRASONIC INTERCONNECTION PACKAGING METHOD"

GENEVA, Nov. 30 -- SONOSILICON CO., LTD. (D3523, 3rd Floor, Building 1 (North Wing), 368 Liuhe Road, BinjiangHangzhou, Zhejiang 310059), 杭州荷声科技有限公司 (中国浙江省杭州市滨江区六和路368号一幢（北）三楼D3523室) filed a patent application (PCT/CN2024/098026) for "NEW MULTI-CHIP ON-CHIP ULTRASONIC INTERCONNECTION PACKAGING METHOD" on Jun 07, 2024. With publication no. WO/2025/241231, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classifi...