GENEVA, April 1 -- SOLUTIA INC. (575 Maryville Centre DriveSt. Louis, MO 63141) filed a patent application (PCT/US2024/047014) for "SCRAPING METHODS FOR SEPARATION OF MULTILAYER INTERLAYERS" on Sep 17, 2024. With publication no. WO/2025/064384, the details related to the patent application was published on Mar 27, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SOHN, Sungkyun (575 Maryville Centre DriveSt. Louis, MO 63141), SABZI, Mohammad (575 Maryville Centre DriveSt. Louis, MO 63141), CHEN, Wenjie (575 Maryville Centre DriveSt. Louis, MO 63141)
Abstract:
Processes are disclosed for sep...