INTERNATIONAL PATENT: SOITEC FILES APPLICATION FOR "METHOD FOR THINNING THE SURFACE LAYER OF AN SOI SUBSTRATE"

GENEVA, May 26 -- SOITEC (Parc Technologique des FontainesChemin des Franques38190 BERNIN) filed a patent application (PCT/EP2024/079109) for "METHOD FOR THINNING THE SURFACE LAYER OF AN SOI SUBSTRATE" on Oct 16, 2024. With publication no. WO/2025/103687, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): VIRAVAUX, Laurent (c/o SOITECParc Technologique des FontainesChemin des Franques38190 BERNIN), MASSY, Damien (c/o SOITECParc Technologique des FontainesChemin des Franques38190 BERNIN), LOUBRIAT, Sebastien (c/o SOITECParc T...