INTERNATIONAL PATENT: SOITEC FILES APPLICATION FOR "METHOD FOR MEASURING THE THICKNESS OF A SUPERFICIAL LAYER OF AN SOI SUBSTRATE"

GENEVA, Oct. 18 -- SOITEC (Parc Technologique des FontainesChemin des Franques38190 Bernin) filed a patent application (PCT/EP2024/083989) for "METHOD FOR MEASURING THE THICKNESS OF A SUPERFICIAL LAYER OF AN SOI SUBSTRATE" on Nov 28, 2024. With publication no. WO/2025/214621, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FOUCAUD, Mathieu (c/o SOITECParc Technologique des FontainesChemin des Franques38190 Bernin), PFERSDORFF, Olivier (c/o SOITECParc Technologique des FontainesChemin des Franques38190 Bernin), CELA, Enric...