INTERNATIONAL PATENT: SNAP INC. FILES APPLICATION FOR "AIR GAPPED DYNAMIC-FLEX CIRCUITS WITH STRIPLINE IMPEDANCE CONTROLS"

GENEVA, Aug. 12 -- SNAP INC. (3000 31st StreetSanta Monica, California 90405) filed a patent application (PCT/US2025/013609) for "AIR GAPPED DYNAMIC-FLEX CIRCUITS WITH STRIPLINE IMPEDANCE CONTROLS" on Jan 29, 2025. With publication no. WO/2025/165889, the details related to the patent application was published on Aug 07, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MOUBEDI, Shaheen (3000 31st StreetSanta Monica, California 90405)

Abstract: The present disclosure relates to flexible printed circuit boards (FPCBs) for augmented reality (AR) eyewear. Disclosed examples provide an FPCB wit...