INTERNATIONAL PATENT: SMITHS INTERCONNECT AMERICAS, INC. FILES APPLICATION FOR "SYSTEMS AND METHODS OF COOLING TEST SOCKET ASSEMBLIES FOR SEMICONDUCTOR INTEGRATED CIRCUITS"

GENEVA, Oct. 1 -- SMITHS INTERCONNECT AMERICAS, INC. (2001 NE 46th Street, Suite 188Kansas City, Missouri 64116) filed a patent application (PCT/US2025/020512) for "SYSTEMS AND METHODS OF COOLING TEST SOCKET ASSEMBLIES FOR SEMICONDUCTOR INTEGRATED CIRCUITS" on Mar 19, 2025. With publication no. WO/2025/199197, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ZHANG, Long (No. 14 Unit, No. 78 Xinglin RoadSuzhou SIP, Jiangsu 215026), MU, Haiyan (No. 1 #901, No. 18Qingcheng RoadSuzhou Industrial Park, PRCJiangsu 215021), ZHOU,...