INTERNATIONAL PATENT: SMITH, JERRED FILES APPLICATION FOR "AUTOMATED SYSTEM AND PROCESS FOR VERTICALLY ASSEMBLING AND DISASSEMBLING A WIRELINE BOTTOM HOLE ASSEMBLY"

GENEVA, Feb. 18 -- SMITH, Jerred (5334 Waterford Dr.Wichita Falls, TX 76310) filed a patent application (PCT/US2024/041532) for "AUTOMATED SYSTEM AND PROCESS FOR VERTICALLY ASSEMBLING AND DISASSEMBLING A WIRELINE BOTTOM HOLE ASSEMBLY" on Aug 08, 2024. With publication no. WO/2025/035007, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SMITH, Jerred (5334 Waterford Dr.Wichita Falls, TX 76310)

Abstract: An automated system (12) and process for vertically assembling and disassembling a wireline bottom hole assembly (BHA) ...