GENEVA, Sept. 9 -- SMC CORPORATION (5-5, Kyobashi 1-chome, Chuo-ku, Tokyo1040031), ＳＭＣ株式会社 (東京都中央区京橋一丁目５番５号) filed a patent application (PCT/JP2024/039539) for "ATTACHMENT/DETACHMENT DEVICE" on Nov 07, 2024. With publication no. WO/2025/182150, the details related to the patent application was published on Sep 04, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): I Shunsuke (c/o SMC CORPORATION, TSUKUBA TECHNICAL CENTER, 2-2, Kinunodai 4-chom...