INTERNATIONAL PATENT: SMART PACKAGING SOLUTIONS FILES APPLICATION FOR "THICK ELECTRONIC MODULE FOR A SMART CARD HAVING A METAL BODY"

GENEVA, Feb. 3 -- SMART PACKAGING SOLUTIONS (85 Avenue de la PlaineZI de Rousset13790 Rousset) filed a patent application (PCT/FR2024/000077) for "THICK ELECTRONIC MODULE FOR A SMART CARD HAVING A METAL BODY" on Jul 23, 2024. With publication no. WO/2025/022042, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CARRIER, Cecile (C/O SMART PACKAGING SOLUTIONS85 Avenue de la PlaineZI de Rousset13790 Rousset), DI BERNARDO, Maxime (C/O SMART PACKAGING SOLUTIONS85 Avenue de la PlaineZI de Rousset13790 Rousset), SAUTET, Alexandre ...