GENEVA, Dec. 29 -- SMART PACKAGING SOLUTIONS (85 AV DE LA PLAINE IN Groupe13790 Rousset) filed a patent application (PCT/EP2025/067313) for "METHOD FOR MANUFACTURING A CHIP CARD" on Jun 19, 2025. With publication no. WO/2025/262237, the details related to the patent application was published on Dec 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): DESJOUIS, Anthony (85 AV DE LA PLAINEC/O SPS13790 Rousset), AUBERT, Damien (C/O SPS85 AV DE LA PLAINE IN Groupe13790 Rousset), BERTRAND, Bertrand (C/O SPS85 AV DE LA PLAINE IN Groupe13790 Rousset)
Abstract: The invention relates to a method for ...