INTERNATIONAL PATENT: SMART PACKAGING SOLUTIONS FILES APPLICATION FOR "LOCALLY TRANSLUCENT CONTACTLESS CHIP CARD INCORPORATING A LEVEL-2 SECURITY ELEMENT"

GENEVA, March 24 -- SMART PACKAGING SOLUTIONS (85 avenue de la PlaineZI de Rousset13790 ROUSSET) filed a patent application (PCT/EP2024/075703) for "LOCALLY TRANSLUCENT CONTACTLESS CHIP CARD INCORPORATING A LEVEL-2 SECURITY ELEMENT" on Sep 13, 2024. With publication no. WO/2025/056795, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PIC, David (c/o SMART PACKAGING SOLUTIONS85 avenue de la PlaineZI de Rousset13790 ROUSSET), MARMUGI, Sebastien (c/o SMART PACKAGING SOLUTIONS85 avenue de la PlaineZI de Rousset13790 ROUSSET) ...