INTERNATIONAL PATENT: SMART PACKAGING SOLUTIONS FILES APPLICATION FOR "ELECTRONIC DEVICE WITH ANISOTROPIC CONDUCTIVE ADHESIVE"

GENEVA, April 14 -- SMART PACKAGING SOLUTIONS (85 avenue de la plaine13790 Rousset) filed a patent application (PCT/EP2024/077509) for "ELECTRONIC DEVICE WITH ANISOTROPIC CONDUCTIVE ADHESIVE" on Sep 30, 2024. With publication no. WO/2025/073646, the details related to the patent application was published on Apr 10, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GERIN, Guillaume (85 AV DE LA PLAINE IN Groupe13790 Rousset), DI BERNARDO, Maxime (85 AV DE LA PLAINE IN Groupe13790 Rousset), AUBERT, Damien (85 AV DE LA PLAINE IN Groupe13790 Rousset)

Abstract: The invention relates to an electr...