INTERNATIONAL PATENT: SMART PACKAGING SOLUTIONS FILES APPLICATION FOR "DOCUMENT COMPRISING A CHIP WITH A TUNEABLE RESONANT FREQUENCY"

GENEVA, April 6 -- SMART PACKAGING SOLUTIONS (85 AV DE LA PLAINE IN Groupe13790 Rousset) filed a patent application (PCT/EP2024/076199) for "DOCUMENT COMPRISING A CHIP WITH A TUNEABLE RESONANT FREQUENCY" on Sep 19, 2024. With publication no. WO/2025/068012, the details related to the patent application was published on Apr 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DESJOUIS, Anthony (85 AV DE LA PLAINE IN Groupe13790 Rousset), FERRIER, Clara (85 AV DE LA PLAINE IN Groupe13790 Rousset), MEAR, Benjamin (85 AV DE LA PLAINE IN Groupe13790 Rousset)

Abstract: The invention relates to a...