INTERNATIONAL PATENT: SK ON CO., LTD., 에스케이온 주식회사 FILES APPLICATION FOR "THERMAL PROPAGATION BLOCKING ASSEMBLY AND BATTERY MODULE COMPRISING THERMAL PROPAGATION BLOCKING ASSEMBLY"

GENEVA, May 19 -- SK ON CO., LTD. (51, Jong-roJongno-gu,Seoul 03161), 에스케이온 주식회사 (서울특별시종로구종로 51) filed a patent application (PCT/KR2024/014964) for "THERMAL PROPAGATION BLOCKING ASSEMBLY AND BATTERY MODULE COMPRISING THERMAL PROPAGATION BLOCKING ASSEMBLY" on Oct 02, 2024. With publication no. WO/2025/100741, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): JANG, Sun-Ho (325 Expo-roYuseong-gu,...