INTERNATIONAL PATENT: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM) FILES APPLICATION FOR "METHODS AND SYSTEMS FOR CONTROLLING HEIGHTS OF DEVICE PACKAGES"

GENEVA, Feb. 4 -- SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM) (10951 White Rock Rd.Rancho Cordova, CA 95670) filed a patent application (PCT/US2025/038700) for "METHODS AND SYSTEMS FOR CONTROLLING HEIGHTS OF DEVICE PACKAGES" on Jul 22, 2025. With publication no. WO/2026/024745, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KHALAF, Bilal (10951 White Rock Rd.Rancho Cordova, CA 95670)

Abstract: This application is directed to packaging technology for providing an electronic device (e.g., a memory device). A memo...