GENEVA, April 28 -- SITEC INDUSTRIETECHNOLOGIE GMBH (Bornaer Strasse 19209114 Chemnitz) filed a patent application (PCT/DE2024/000084) for "METHOD FOR CONNECTING METAL CIRCUIT BOARDS BY MEANS OF HIGH-ENERGY RADIATION" on Oct 14, 2024. With publication no. WO/2025/082558, the details related to the patent application was published on Apr 24, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): LAU, Michael (RingstraBe 1809573 Leubsdorf), RIEDEL, Lutz (Waldenburger StraBe 3008393 Meerane)
Abstract:
The invention relates to a method for connecting metal circuit boards by means of high-energy radi...