INTERNATIONAL PATENT: SINGAPORE UNIVERSITY OF TECHNOLOGY AND DESIGN FILES APPLICATION FOR "LIGHT-RESPONSIVE ADHESIVE DEBONDING METHOD"

GENEVA, Dec. 23 -- SINGAPORE UNIVERSITY OF TECHNOLOGY AND DESIGN (8 Somapah Road,Singapore 487372) filed a patent application (PCT/SG2025/050409) for "LIGHT-RESPONSIVE ADHESIVE DEBONDING METHOD" on Jun 12, 2025. With publication no. WO/2025/259195, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LOW, Hong Yee (c/o Singapore University of Technology and Design,8 Somapah Road,Singapore 487372), WIWATTANAKUL, Pornsraung (c/o Singapore University of Technology and Design,8 Somapah Road,Singapore 487372), VALDIVIA Y ALVARADO G...