INTERNATIONAL PATENT: SILTRONIC AG FILES APPLICATION FOR "SEMICONDUCTOR WAFER HAVING A MULTILAYERED STRUCTURE AND METHOD FOR PRODUCING THE SAME"

GENEVA, April 19 -- SILTRONIC AG (Einsteinstr. 172Tower B / Blue Tower81677 Munchen) filed a patent application (PCT/EP2024/056000) for "SEMICONDUCTOR WAFER HAVING A MULTILAYERED STRUCTURE AND METHOD FOR PRODUCING THE SAME" on Mar 07, 2024. With publication no. WO/2025/078038, the details related to the patent application was published on Apr 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MICHLER, Sondre (Tittmoningerstr. 5184489 Burghausen), STORCK, Peter (DescartesstraBe 2084489 Burghausen), THAPA, Sarad Bahadur (BrahmsstraBe 1184489 Burghausen)

Abstract: A semiconductor wafer havi...