INTERNATIONAL PATENT: SILTRONIC AG FILES APPLICATION FOR "PARAMETRISATION OF THE ROUNDING OF A WAFER MADE OF SEMICONDUCTOR MATERIAL"

GENEVA, May 5 -- SILTRONIC AG (Einsteinstr. 172 Tower B / Blue Tower81677 Munchen) filed a patent application (PCT/EP2024/079061) for "PARAMETRISATION OF THE ROUNDING OF A WAFER MADE OF SEMICONDUCTOR MATERIAL" on Oct 15, 2024. With publication no. WO/2025/087738, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HAID, Richard (Muhlbachstr. 8884547 Emmerting), HAGER, Thomas (Am Geishof 7b84323 Massing), RIEDEL, Frank (Bergfeld 2484529 Tittmoning), ZIERER, Robert (Am Kronerstolln 8709599 Freiberg)

Abstract: The invention r...