GENEVA, Dec. 29 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2025/065923) for "THERMALLY CONDUCTIVE COMPOSITIONS WITH REDUCED DENSITY" on Jun 06, 2025. With publication no. WO/2025/261808, the details related to the patent application was published on Dec 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): GUENE, Lia (c/o Sika Automotive France SASZ.I. des Bethunes95310 Saint-Ouen-l'Aumone), MERNAKA, Jana Beata (c/o Sika Automotive France SASZ.I. des Bethunes95310 Saint-Ouen-l'Aumone)
Abstract: The invention relates to a thermally conductive composition...