GENEVA, Sept. 21 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2025/056614) for "ONE-COMPONENT EXPANDABLE THERMOSETTING EPOXY COMPOSITION WITH CONSISTENT EXPANSION PROPERTIES AFTER HUMIDITY STORAGE" on Mar 11, 2025. With publication no. WO/2025/190938, the details related to the patent application was published on Sep 18, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): CASPARI, Philip Horst (Grimselstrasse 18048 Zurich), MUNZINGER, Noah (Freilagerstrasse 778047 Zurich)
Abstract:
The present invention relates to a one-component thermosetting epoxy resin...