INTERNATIONAL PATENT: SIKA TECHNOLOGY AG FILES APPLICATION FOR "NOZZLE FOR A DEVICE FOR MANUFACTURING A COMPONENT IN LAYERS, DEVICE COMPRISING SUCH A NOZZLE AND METHOD FOR PRODUCING A COMPONENT"

GENEVA, May 5 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2024/080328) for "NOZZLE FOR A DEVICE FOR MANUFACTURING A COMPONENT IN LAYERS, DEVICE COMPRISING SUCH A NOZZLE, AND METHOD FOR PRODUCING A COMPONENT" on Oct 25, 2024. With publication no. WO/2025/088184, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GOHLICH, Benjamin (Teckstr. 272585 Riederich), POLZFUSS, Christian (Schwabstr. 1172574 Bad Urach)

Abstract: The invention relates to a nozzle (10) for a device for manufacturi...