GENEVA, July 29 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2025/050927) for "MOISTURE CURABLE HOT-MELT ADHESIVE HAVING HIGH TRANSPARENCY" on Jan 15, 2025. With publication no. WO/2025/153554, the details related to the patent application was published on Jul 24, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SCHMIDER, Martin (Im Sandfeld 1721335 Luneburg)
Abstract:
The invention relates to an adhesive composition comprising: a) At least one polyurethane prepolymer PU, b) At least one poly(meth)acrylate AC, and c) Optionally at least one catalyst CA...