GENEVA, Aug. 11 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2025/052413) for "HOT-MELT ADHESIVE COMPOSITION HAVING ADJUSTABLE CURING BEHAVIOR" on Jan 30, 2025. With publication no. WO/2025/163075, the details related to the patent application was published on Aug 07, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): BORDEANU, Nicolae (Zielstrasse 28400 Winterthur), HENTSCHEL, Anne (Kapitelbuschweg 422527 Hamburg)
Abstract:
The invention relates to a hot-melt adhesive composition: a) A blocked polyurethane prepolymer PU, b) At least one with isocyanate ...