GENEVA, May 27 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2024/081337) for "HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR PRE-CURING PROCESSES WITHOUT ADDITIONAL METAL JOINING TECHNIQUES" on Nov 06, 2024. With publication no. WO/2025/103841, the details related to the patent application was published on May 22, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): GALLO, Dominique (Wehntalerstrasse 2958106 Adlikon bei Regensdorf)
Abstract:
The invention relates to a thermosetting one-component epoxy resin composition comprising at least one liquid arom...