GENEVA, Feb. 3 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2024/070465) for "HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR LOW CURING TEMPERATURE WITH GOOD STORAGE STABILITY" on Jul 18, 2024. With publication no. WO/2025/021662, the details related to the patent application was published on Jan 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KRUGER, Christian (Tuffenwies 168048 Zurich), BOFER, Cornelia (Tuffenwies 168048 Zurich)
Abstract:
The present invention relates to thermosetting epoxy resin compositions comprising an epoxy resin, a dihyd...