GENEVA, April 14 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2024/077858) for "HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR LOW CURING TEMPERATURE WITH GOOD OPEN TIME AND CORROSION RESISTANCE" on Oct 03, 2024. With publication no. WO/2025/073846, the details related to the patent application was published on Apr 10, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): GABERELL, Fabio (Kleinmattstrasse 86003 Luzern), HALTINER, Sara (Rohrstrasse 178952 Schlieren), LEMPEREUR, Juliette (Widmenhalde 118953 Dietikon)
Abstract:
The present invention relates ...