INTERNATIONAL PATENT: SIKA TECHNOLOGY AG FILES APPLICATION FOR "HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR LOW CURING TEMPERATURE WITH GOOD ADHESION AND TOUGHENING ABILITIES"

Posted On: 2025-07-29

GENEVA, July 29 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2025/050764) for "HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR LOW CURING TEMPERATURE WITH GOOD ADHESION AND TOUGHENING ABILITIES" on Jan 14, 2025. With publication no. WO/2025/153474, the details related to the patent application was published on Jul 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WEN, Weijian (24388 Nantucket DriveNovi, Michigan 48374)

Abstract: The present invention relates to thermosetting epoxy resin compositions comprising an epoxy resin, a dihydrazide curing a...

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INTERNATIONAL PATENT: SIKA TECHNOLOGY AG FILES APPLICATION FOR "HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR LOW CURING TEMPERATURE WITH GOOD ADHESION AND TOUGHENING ABILITIES"