GENEVA, Feb. 3 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2024/070461) for "ADHESIVE WITH IMPROVED ADHESION ON EPOXY RESIN ADHESIVE REMNANTS" on Jul 18, 2024. With publication no. WO/2025/021660, the details related to the patent application was published on Jan 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ILLI, Tobias (Tuffenwies 168048 Zurich)
Abstract:
The invention relates to the use of an epoxy resin adhesive for adhesively bonding a substrate at least partially coated with a cured epoxy resin adhesive, characterised in that the adhesive...