GENEVA, May 5 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2024/079859) for "ADHESIVE COMPOSITION WITH IMPROVED THERMAL STABILITY" on Oct 22, 2024. With publication no. WO/2025/087927, the details related to the patent application was published on May 01, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): VILA FERREIRA, Juan Ramon (Hilpertweg 822523 Hamburg), BECERRA SIABATO, Diana Valentina (Kuehnbachring 51 i22045 Hamburg), URBACH, Dirk (Viljandiring 4322926 Ahrensburg), UEDING, Daniel (HafenstraBe 825436 Tornesch)
Abstract:
The invention is directed t...