GENEVA, Feb. 3 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2024/071210) for "A METHOD FOR WATERPROOFING SUBSTRATES" on Jul 25, 2024. With publication no. WO/2025/021958, the details related to the patent application was published on Jan 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ALVES DOS SANTOS, Flaviane (201 Polito AvenueLyndhurst, New Jersey 07071), PECHER, Johannes (Via Gioacchino Rossini 2237060 Castel D'Azzano)
Abstract:
The invention relates to a method for waterproofing a substrate (1) comprising steps of: I) Heating a hot melt bitum...