INTERNATIONAL PATENT: SIEMENS SCHWEIZ AG FILES APPLICATION FOR "EFFICIENT ADDRESSING OF DETACHED I/O-MODULES AND I/O-BUS SEGMENTS"

GENEVA, Nov. 24 -- SIEMENS SCHWEIZ AG (Freilagerstrasse 408047 Zurich) filed a patent application (PCT/EP2025/061265) for "EFFICIENT ADDRESSING OF DETACHED I/O-MODULES AND I/O-BUS SEGMENTS" on Apr 24, 2025. With publication no. WO/2025/237648, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KYBURZ, Beat (Pfaffacherstrasse 23a8913 Ottenbach)

Abstract: The addressing of I/O-Modules (I/O) of a Building Automation System shall be simplified. Therefore, there is provided a method of automatically addressing a plurality of I/O...