GENEVA, Nov. 24 -- SIEMENS SCHWEIZ AG (Freilagerstrasse 408047 Zurich) filed a patent application (PCT/EP2025/061275) for "EFFICIENT ADDRESSING AND COMMISSIONING OF DETACHED I/O-MODULES" on Apr 24, 2025. With publication no. WO/2025/237650, the details related to the patent application was published on Nov 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KYBURZ, Beat (Pfaffacherstrasse 23a8913 Ottenbach), CAMENZIND, Oskar (Im Adelmann 36422 Steinen)
Abstract: Method and arrangement for addressing and commissioning of detached I/O-Modules of devices of a Building Automation System connect...