GENEVA, Aug. 4 -- SIEMENS MOBILITY GMBH (Otto-Hahn-Ring 681739 Munchen) filed a patent application (PCT/EP2024/086453) for "FRONT FLAP MODULE" on Dec 16, 2024. With publication no. WO/2025/157521, the details related to the patent application was published on Jul 31, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SCHIPPERGES, Simon (Bahnhofstr. 5841352 Korschenbroich), STARKE, Jurgen (Fleher Str. 6740223 Dusseldorf)
Abstract:
The invention relates to a front flap module (10) for a track-guided vehicle (1), in particular for a rail vehicle, comprising at least one front flap (100, 100') a...