GENEVA, March 10 -- SIEMENS INDUSTRY SOFTWARE INC. (5800 Granite Parkway, Suite 600Plano, Texas 75024) filed a patent application (PCT/US2023/031287) for "THREE-DIMENSIONAL PHOTOMASK TRANSMISSION WITH KERNEL-BASED MODELING" on Aug 28, 2023. With publication no. WO/2025/048779, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CLIFFORD, Christopher (1827 Elm StreetAlameda, California 94501)

Abstract: This application discloses a computing system to simulate three-dimensional light transmission in a near-field of a lithogr...