GENEVA, June 2 -- SIEMENS INDUSTRY SOFTWARE INC. (5800 Granite Parkway, Suite 600Plano, TX 75024) filed a patent application (PCT/IB2024/060688) for "MACHINING A WORKPIECE BY MEANS OF A B-AXIS LATHE MACHINE" on Oct 30, 2024. With publication no. WO/2025/109404, the details related to the patent application was published on May 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): BRAKE, Sebastian (Krefelder Str. 10350670 Koln)
Abstract:
Method of machining a workpiece (WPC) by means of a B-axis lathe machine (MCH), where the method, involves the continuous change of the angular position (AG...