INTERNATIONAL PATENT: SIEMENS INDUSTRY SOFTWARE INC. FILES APPLICATION FOR "CREATING A LAYOUT OF A PRINTED CIRCUIT BOARD (PCB) INCLUDING ELECTRICAL COMPONENTS USING A MODEL FOR ASSIGNING THE ELECTRICAL COMPONENTS ONTO POSITIONS OF A PCB ARRAY"

GENEVA, Sept. 10 -- SIEMENS INDUSTRY SOFTWARE INC. (5800 Granite Parkway, Suite 600Plano, Texas 75024) filed a patent application (PCT/US2024/017913) for "CREATING A LAYOUT OF A PRINTED CIRCUIT BOARD (PCB) INCLUDING ELECTRICAL COMPONENTS USING A MODEL FOR ASSIGNING THE ELECTRICAL COMPONENTS ONTO POSITIONS OF A PCB ARRAY" on Feb 29, 2024. With publication no. WO/2025/183702, the details related to the patent application was published on Sep 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): RINGSQUANDL, Martin (Amselweg 1583064 Raubling), MOGOREANU, Serghei (Hugo-Weiss-Str 981827 Munchen), H...