INTERNATIONAL PATENT: SIEMENS CORPORATION FILES APPLICATION FOR "MULTI-FIDELITY MODELING APPROACH FOR POLYMER PROPERTY PREDICTION"

GENEVA, March 4 -- SIEMENS CORPORATION (200 Massachusetts Avenue, NW, Suite 600Washington, DC 20001) filed a patent application (PCT/US2023/030567) for "MULTI-FIDELITY MODELING APPROACH FOR POLYMER PROPERTY PREDICTION" on Aug 18, 2023. With publication no. WO/2025/042380, the details related to the patent application was published on Feb 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WESSELS, Michiel (807 Deemers LandingNew Castle, Delaware 19720), GUNDAVARAPU, Sesha (#C-1111, Aratt Firenza ApartmentsBangalore 560100), DELANNOY, Jean Yves (207 E. Cobblefield CourtNewark, Delaware 19713)...