INTERNATIONAL PATENT: SIEMENS AKTIENGESELLSCHAFT FILES APPLICATION FOR "SEMICONDUCTOR ASSEMBLY WITH A FIRST SEMICONDUCTOR ELEMENT"

GENEVA, May 5 -- SIEMENS AKTIENGESELLSCHAFT (Werner-von-Siemens-StraBe 180333 Munchen) filed a patent application (PCT/EP2024/074837) for "SEMICONDUCTOR ASSEMBLY WITH A FIRST SEMICONDUCTOR ELEMENT" on Sep 05, 2024. With publication no. WO/2025/087599, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HOHNE, Silvio (John-F.-Kennedy-Ring 13b91301 Forchheim), KASBAUER, Michael (Auf der Schanz 2290453 Nurnberg), MAIER, Lukas (Froschau 1191077 Neunkirchen am Brand)

Abstract: The invention relates to a semiconductor assembly (...