INTERNATIONAL PATENT: SIEMENS AKTIENGESELLSCHAFT FILES APPLICATION FOR "METHOD FOR EVALUATING A SOLDERING PROCESS IN A SOLDERING UNIT FOR LIQUID SOLDER BY MEANS OF A MONITORING DEVICE, COMPUTER PROGRAM PRODUCT, COMPUTER-READABLE MEMORY DEVICE AND MONITORING DEVICE"

GENEVA, March 9 -- SIEMENS AKTIENGESELLSCHAFT (Werner-von-Siemens-StraBe 180333 Munchen) filed a patent application (PCT/EP2024/071660) for "METHOD FOR EVALUATING A SOLDERING PROCESS IN A SOLDERING UNIT FOR LIQUID SOLDER BY MEANS OF A MONITORING DEVICE, COMPUTER PROGRAM PRODUCT, COMPUTER-READABLE MEMORY DEVICE AND MONITORING DEVICE" on Jul 31, 2024. With publication no. WO/2025/045491, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HANISCH, Michael (Burghardtstr. 416540 Hohen Neuendorf), JARCHOFF, Kay (Stieleichenstr. 22...