INTERNATIONAL PATENT: SIEMENS AKTIENGESELLSCHAFT FILES APPLICATION FOR "HOUSING PART FOR A SEMICONDUCTOR MODULE"

GENEVA, Sept. 16 -- SIEMENS AKTIENGESELLSCHAFT (Werner-von-Siemens-StraBe 180333 Munchen) filed a patent application (PCT/EP2025/050871) for "HOUSING PART FOR A SEMICONDUCTOR MODULE" on Jan 15, 2025. With publication no. WO/2025/185864, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KURTEN, Bernd (Eichenstr. 3590587 Obermichelbach)

Abstract: The invention relates to a housing part (2) for a semiconductor module (22). In order to facilitate a reliable wiring, the invention proposes that the housing part (2) comprises t...