GENEVA, Feb. 24 -- SIEMENS AKTIENGESELLSCHAFT (Werner-von-Siemens-Strasse 180333 Munchen), SIEMENS LTD., CHINA (7, Wangjing Zhonghuannan LuChaoyang District, Beijing 100102) filed a patent application (PCT/CN2023/113190) for "ENHANCED PAIRING IN AGENT-BASED PROCESS AUTOMATION" on Aug 15, 2023. With publication no. WO/2025/035399, the details related to the patent application was published on Feb 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): LABISCH, Daniel (Spechtweg 14,76149 Karlsruhe), WENDELBERGER, Klaus Walter (Brahmsstr. 2, St.68789 Leon-Rot), NANDOLA, Nareshkumar (73 Springwood C...